Method for manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the same

摘要

The present invention is to form a groove or trench on one surface of a base substrate of a conductive material for a method of manufacturing a semiconductor package substrate and a semiconductor package substrate manufactured using the semiconductor device substrate, which can be easily connected to a semiconductor device while the process is simple. Step, filling the groove or trench with resin, and etching the other surface of the base substrate so that the resin filling the groove or trench is exposed, and on the exposed portion of the base substrate of the resin and the one surface of the base substrate. A semiconductor package substrate comprising forming an integral first conductive layer, and performing electroplating to form a second conductive layer on the other surface of the base substrate, and removing the first conductive layer. A manufacturing method and a semiconductor package substrate manufactured using the same are provided.