A semiconductor package with exposed redistribution layer features and related packaging and testing processes

摘要

A method of packaging a semiconductor device with a bond pad on a surface thereof includes forming a redistribution material electrically coupled to the bond pad, forming a dielectric material over the redistribution material, and removing a first portion of the dielectric material to form a first portion of the To expose redistribution material. Semiconductor packages may include a redistribution layer having a first portion adjacent to and coupled to a first contact of the package, a second portion exposed through a first opening in a dielectric material, and a redistribution line connected to a first bond pad first section and the second section is electrically coupled. Such a housing can be tested by bringing at least one probe needle into contact with at least one connector of the housing, providing a test signal from the probe needle via the connector to the housing, and detecting signals using the needle.