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Substrate processing apparatus and substrate processing method

机译:基板处理装置及基板处理方法

摘要

A substrate processing apparatus (1) that processes a substrate (S) by means of particles has a transport mechanism (CMA) which is configured to transport the substrate (S) along a transport surface (CS), a particle source (T), which configured to emit particles, a rotating mechanism (RTM) configured to pivot the particle source (T) about an axis of rotation, and a moving mechanism (RVM) configured to rotate the particle source (T) moved such that a distance between the particle source (T) and the transport surface (CS) is changed.
机译:借助于颗粒处理衬底(S)的衬底处理设备(1)具有构造成沿着传送表面(CS)传送衬底(S)的传送机构(CMA),颗粒源(T),粒子发射器配置为发射粒子,旋转机构(RTM)配置为使粒子源(T)绕旋转轴旋转,移动机构(RVM)配置为旋转粒子源(T),使粒子源(T)之间的距离粒子源(T)和传输表面(CS)发生了变化。

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