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Cross-sectional atomic force microscopy of III-V semiconductor device structures

机译:III-V半导体器件结构的横截面原子力显微镜

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摘要

Atomic force microscopy (AFM) in air has been used to study various III-V semiconductor heterostructures. Topography of the (110) cleaved cross-sections has been examined where oxidation processes modify the surface and allow the structures to be investigated. This research aims to establish the potential of this technique as a metrology tool for use in an industrial environment. AlGas/GaAs was used as the prototypical system, and a test structure grown in order to establish how differences in oxidation rates between the different material compositions may be used to establish composition and layer thickness for heterostructure devices. The dependence of oxidation rate on layer composition and thickness has been confirmed. The mechanisms of field-aided and diffusion limited growth have been determined to be responsible for the oxidation of the AlGas layers within the test structure, with field aided being the dominant mode for materials x 0.8 and diffusion limited dominating for layers x > 0.8 observed. In addition, a new effect of interface enhanced oxide growth have been observed and quantified in terms of layer composition. It is found to be most important for Al09Gao, As layers of 50--100 nm thickness during relatively early stages of oxidation. The use of phase detection microscopy has also been applied for the first time to determine the presence of layers where no measurable step heights are present. Unlike previous reports, there has been no observed difference in oxidation rate between p- and -type materials. These findings have been applied to real device structures, where the material composition of Al/JaAs can be determined to within x 0.02 and layer widths may be determined to within 3 nm at best. It has been shown that step height differences of as little as 0.1 A are sufficient to distinguish between layers, and that quantum wells of as little as 42 A in width are detectable.
机译:空气中的原子力显微镜(AFM)已用于研究各种III-V半导体异质结构。已经检查了(110)裂解截面的形貌,其中氧化过程修饰了表面并允许研究结构。这项研究旨在确立该技术作为工业环境中的计量工具的潜力。 AlGas / GaAs被用作原型系统,为了确定不同材料成分之间的氧化速率差异可如何用于建立异质结构器件的成分和层厚度,使用了生长的测试结构。已经证实氧化速率对层组成和厚度的依赖性。已经确定了场辅助和扩散受限生长的机制是测试结构内AlGas层氧化的原因,其中场辅助是材料x <0.8的主导模式,而扩散受限则是x> 0.8的主导层。另外,已经观察到并根据层组成量化了界面增强的氧化物生长的新效果。对于Al09Gao,发现最重要的是在相对较早的氧化阶段形成厚度为50--100 nm的As层。相位检测显微镜的使用也已首次应用于确定不存在可测量台阶高度的层的存在。与以前的报道不同,在p型和p型材料之间没有观察到氧化速率的差异。这些发现已应用于实际的器件结构中,其中Al / JaAs的材料成分可以确定为x 0.02以内,层宽度最多可以确定为3 nm以内。已经表明,仅0.1A的台阶高度差就足以区分各层,并且可以检测到宽度仅42A的量子阱。

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    Jenkins Christian;

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  • 年度 2004
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  • 原文格式 PDF
  • 正文语种 English
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