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Development of lead-free thin-film dielectrics for capacitor applications

机译:开发用于电容器应用的无铅薄膜电介质

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摘要

This PhD project aims to develop lead-free thin-film dielectric materials for fixed value, voltage tunable and high-k zipping variable capacitors using growth techniques that can be scaled for silicon batch fabrication. The thesis specifically details the growth and characterisation of barium zirconate titanate (BZT) and bismuth zinc niobate (BZN) dielectric thin films. Fixed value and tunable capacitors have been realised through the use of low and high permittivity dielectric thin film materials in both the amorphous and crystalline states. Planar devices fabricated using BZT and BZN thin-film dielectrics were grown by sol-gel and RF magnetron sputtering, respectively. The effects of different bottom electrodes were also investigated. Capacitors in metal-insulator-metal (MIM) structure have been fabricated to characterise the dielectric films at low frequency (to 300 kHz). Finding alternative higher permittivity dielectrics to SiO2 for various capacitor and isolation layer applications can be a challenge. Trials were conducted that looked at using amorphous BZT and nano-crystalline/crystalline BZN as a low-k dielectric insulator. Dielectric constants of ~50 were typical for BZN, but much lower permittivity was achieved for amorphous BZT, between 2 and 15 when deposited on Cr/Au bottom electrode. Breakdown strength of amorphous BZT was extremely high (2.0 MV/cm) and far superior to that of BZN (0.35 MV/cm). The dielectric strength of BZN was increased to 0.56 MV/cm when BZN was grown on a BZT seed layer due to a change in the microstructure of the BZN film from granular to columnar. The development of a suitable dielectric BZN for use with polymer substrate was also investigated and MIM capacitors fabricated by sputter deposition. Preliminary results for nano-crystalline BZN thin film growth on gold coated liquid crystal polymer (LCP) substrates appeared encouraging with dielectric constant of 27 and loss 0.005. Crystallised BZT thin films can be used to good effect as lead-free dielectric material in tunable devices. For BZT in the ferroelectric phase, excellent tunabilities of 80% were realised when deposited on platinised silicon. This wasfound not to be the case for BZT in the paraelectric phase where tunabilities tended to be ~60% at best. The dielectric properties of thin-film MIM capacitors can be enhanced by the use of lower resistivity bottom electrode such as gold. Previous research has failed to demonstrate growth and crystallisation of BZT on gold electrode due to the fact that it is technically difficult using the sol-gel method. Films tend to crack after annealing. I have found that films can be stabilised, and the tunability of BZT thin film in the paraelectric phase can be increased significantly, by growing BZT on gold bottom electrode using a BZN buffer layer 25nm thick. A peak tunability of 83% was achieved while maintaining a low dielectric loss of ~0.01. Novel BZT multilayer structures incorporating both ferroelectric and paraelectric compositions were grown on platinised silicon resulting in a tunability of 82% at a bias field 600 kV/cm. Based on the success of growing good quality BZN thin films on gold bottom electrode, it was decided to use BZN thin film as one of the high-k dielectrics in the zipping varactor, a miniature MEMS tunable device. Trials were performed that looked at depositing BZN on thick (800nm) gold coated silicon and glass. This was successful on small sample pieces but failed when scaled up to full device wafer size (100 mm diameter) due to Cr/Au diffusion into the dielectric layer. To overcome this, a 300nm thick BZN film was sputter deposited on Ti/Pt and Ti/Au/Pt coated 100 mm glass device wafers and processed to form the dielectric layer and bottom electrode of the capacitor. As part of the process the BZN layer required patterning. Wet etching of the small features was inappropriate due to undercutting of the structure; dry etching was therefore necessary. Prior to this work there had been nothing reported on the dry etching of BZN, only wet etched using a 1:10 HF-deionised H2O solution. In this work, thin-film BZN was reactively ion etched in Ar/CHF3 plasma at a rate of 6nm per minute with excellent selectivity over platinum of 10:1. Fabrication of the curved top electrode, final assembly and device testing were undertaken by a group at Imperial College London who were collaborators on a work programme entitled, “Integrated Functional Materials for System-in-Package Applications”.
机译:该博士项目旨在使用可扩展规模的批量生产技术开发用于固定值,电压可调和高k拉链可变电容器的无铅薄膜电介质材料。本文具体介绍了锆钛酸钡(BZT)和铌酸铋锌(BZN)电介质薄膜的生长和表征。通过使用处于非晶态和结晶态的低和高介电常数介电薄膜材料,已经实现了固定值和可调电容器。使用BZT和BZN薄膜电介质制造的平面器件分别通过溶胶-凝胶法和RF磁控管溅射法生长。还研究了不同底部电极的影响。已经制造了金属-绝缘体-金属(MIM)结构的电容器,以表征低频(至300 kHz)的介电膜。为各种电容器和隔离层应用寻找替代SiO2的更高介电常数的电介质可能是一个挑战。进行了使用非晶态BZT和纳米晶体/晶体BZN作为低k介电绝缘体的试验。 BZN的介电常数通常约为50,但是非晶BZT的介电常数要低得多,当沉积在Cr / Au底部电极上时介电常数在2到15之间。非晶态BZT的击穿强度极高(2.0 MV / cm),远优于BZN的击穿强度(0.35 MV / cm)。当BZN在BZT种子层上生长时,由于BZN薄膜的微观结构从颗粒状变为柱状,BZN的介电强度提高到0.56 MV / cm。还研究了适用于聚合物衬底的电介质BZN的开发,并通过溅射沉积制造了MIM电容器。纳米金BZN薄膜在镀金液晶聚合物(LCP)衬底上生长的初步结果似乎令人鼓舞,介电常数为27,损耗为0.005。结晶的BZT薄膜可用作可调器件中的无铅介电材料,效果良好。对于铁电相中的BZT,当沉积在镀铂硅上时,可实现80%的出色可调性。人们发现,在顺电阶段,BZT并非如此,在这种情况下,可调性充其量最多只能达到60%。薄膜MIM电容器的介电特性可通过使用较低电阻率的底部电极(如金)来增强。以前的研究未能证明BZT在金电极上的生长和结晶,原因是使用溶胶凝胶法在技术上存在困难。膜在退火后易于破裂。我发现通过使用25nm厚的BZN缓冲层在金底电极上生长BZT,可以稳定薄膜,并可以显着提高顺电相中BZT薄膜的可调性。在保持〜0.01的低介电损耗的同时,实现了83%的峰值可调性。结合了铁电和顺电成分的新型BZT多层结构在镀铂硅上生长,在600 kV / cm的偏置电场下可调谐度达到82%。基于在金底电极上生长高质量BZN薄膜的成功经验,决定将BZN薄膜用作拉链式变容二极管(一种微型MEMS可调器件)中的高k电介质之一。进行了一些试验,研究了在厚(800nm)镀金的硅和玻璃上沉积BZN的情况。这在小样品件上是成功的,但由于Cr / Au扩散到电介质层中而放大到整个器件晶圆尺寸(直径为100 mm)时失败。为了克服这个问题,将300nm厚的BZN膜溅射沉积在Ti / Pt和Ti / Au / Pt涂覆的100 mm玻璃器件晶片上,并进行处理,以形成介电层和电容器的底部电极。作为该过程的一部分,BZN层需要构图。由于结构底切,湿蚀刻小特征是不合适的。因此必须进行干法蚀刻。在进行这项工作之前,没有任何关于BZN干蚀刻的报道,仅使用1:10 HF去离子的H2O溶液进行湿蚀刻。在这项工作中,薄膜BZN在Ar / CHF3等离子体中以6nm / min的速度进行了反应性离子蚀刻,对铂的选择性为10:1。弯曲的顶部电极的制造,最终组装和设备测试由伦敦帝国理工学院的一个小组进行,该小组的合作者名为“用于系统级封装应用的集成功能材料”。

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