首页> 外国专利> COMPOSITION FOR THIN-FILM CAPACITOR DEVICE, HIGH DIELECTRIC CONSTANT INSULATOR FILM, THIN-FILM CAPACITOR DEVICE, THIN-FILM MULTILAYER CAPACITOR, ELECTRONIC CIRCUIT AND ELECTRONIC DEVICE

COMPOSITION FOR THIN-FILM CAPACITOR DEVICE, HIGH DIELECTRIC CONSTANT INSULATOR FILM, THIN-FILM CAPACITOR DEVICE, THIN-FILM MULTILAYER CAPACITOR, ELECTRONIC CIRCUIT AND ELECTRONIC DEVICE

机译:薄膜电容器设备,高介电常数绝缘膜,薄膜电容器设备,薄膜多层电容器,电子电路和电子设备的组成

摘要

A thin film capacity element composition includes a first bismuth layer-structured compound having positive temperature characteristics, that a specific permittivity rises as the temperature rises, in at least a part of a predetermined temperature range and a second bismuth layer-structured compound having negative temperature characteristics, that a specific permittivity declines as a temperature rises, in at least a part of said predetermined temperature range at any mixing ratio; wherein the bismuth layer-structured compound is expressed by a composition formula of CaxSr(1-x)Bi4Ti4O15.
机译:薄膜电容元件组合物包括在预定温度范围的至少一部分中具有正温度特性,且介电常数随温度升高而升高的第一铋层结构化合物和具有负温度的第二铋层结构化合物。特性,在任意混合比例下,在所述预定温度范围的至少一部分中,介电常数随着温度的升高而降低。其中铋层结构的化合物由CaxSr(1-x)Bi4Ti4O15的组成式表示。

著录项

  • 公开/公告号EP1598840A1

    专利类型

  • 公开/公告日2005-11-23

    原文格式PDF

  • 申请/专利权人 TDK CORPORATION;

    申请/专利号EP20030772856

  • 申请日2003-11-18

  • 分类号H01G4/33;H01G4/20;H01G4/12;H01L27/04;H01L27/108;

  • 国家 EP

  • 入库时间 2022-08-21 21:32:43

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