The usage of a very large scale integrated circuits generate high heat fluxes and require an effective cooling system. A microchannel heat sink (MCHS) is one of the reliable cooling systems that had been applied. In terms of performance, a MCHS can be appraised by obtaining low total thermal resistance and pumping power. However, as the total thermal resistance decreases, the pumping power will increase. A few studies have been focused on the minimization of the thermal resistance and pumping power of a multi-stack MCHS. Optimization of two objective functions which are the total thermal resistance and pumping power has been done by using genetic algorithm. It is demonstrated that both objective functions can be minimized by optimizing two design variables which are the channel aspect ratio, α, and wall width ratio,β. It was found that the usage of a stacked configuration for the MCHS is able to reduce the total thermal resistance. From the optimization, it was found that the optimum number of stacks that can be implemented is three. With the three-stack configuration, the total thermal resistance found is 0.1180 K/W which is 21.8% less compared to the single-stack MCHS. However, the pumping power needed for the three-stack MCHS is increased by 0.17 % compared to single-stack which is 0.7535 W.
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机译：大规模集成电路的使用产生高热通量，并且需要有效的冷却系统。微通道散热器（MCHS）是已应用的可靠冷却系统之一。在性能方面，可以通过获得较低的总热阻和泵浦功率来评估MCHS。但是，随着总热阻的降低，泵浦功率将增加。一些研究集中在最小化多堆栈MCHS的热阻和泵浦功率上。利用遗传算法对总热阻和抽运功率这两个目标函数进行了优化。结果表明，可以通过优化两个设计变量（通道纵横比α和壁宽比率β）来最小化两个目标函数。已经发现，对于MCHS使用堆叠配置能够降低总热阻。从优化中发现，可以实现的最佳堆栈数为3。采用三层结构时，发现的总热阻为0.1180 K / W，与单层MCHS相比，降低了21.8％。但是，与单堆0.7535 W相比，三堆MCHS所需的泵浦功率增加了0.17％。
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