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首页> 外文期刊>Journal of Microelectronics and Electronic Packaging >Numerical Prediction of Thermal Performance of Water Cooled Multi-Stack MicroChannel Heat Sink with Counterflow Arrangement
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Numerical Prediction of Thermal Performance of Water Cooled Multi-Stack MicroChannel Heat Sink with Counterflow Arrangement

机译:逆流布置的水冷多栈微通道微通道散热器热性能的数值预测

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摘要

Thermal performance of a water cooled multistack microchannel heat sink with counterflow arrangement has been analyzed using the finite element method. Performance parameters such as thermal resistance, pressure drop, and pumping power are computed for a typical counterflow heat sink with different number of stacks. The temperature distribution in a typical multistack counterflow microchannel heat sink is obtained for different numbers of stacks and plotted along the channel length. A parametric study involving the effects of number of stacks and channel aspect ratio on thermal resistance and pressure drop of the heat sink is done. The finite element model developed for the analysis is simple and consumes less computational time.
机译:已经使用有限元方法分析了带有逆流布置的水冷多堆叠微通道散热器的热性能。针对具有不同数量烟囱的典型逆流散热器,计算了诸如热阻,压降和泵浦功率之类的性能参数。对于不同数量的烟囱,可以获得典型的多烟囱逆流微通道散热器中的温度分布,并沿着通道长度进行绘制。进行了涉及烟囱数量和通道长宽比对散热器热阻和压降影响的参数研究。为分析而开发的有限元模型很简单,并且消耗较少的计算时间。

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