Heat source e.g. power component, cooling arrangement for e.g. power electronic circuit, has thermoelectric cooling element for dissipating distributed heat to heat sink that is thermally coupled with substrate of electronic circuit

摘要

The arrangement has a thermoelectric cooling element (20) for transferring heat dissipated by a heat source (12) to a heat sink coupled with an electronic circuit. The heat source and the cooling element are arranged adjacent to each other on a common substrate (10) of the circuit. The cooling element laterally distributes heat that is locally dissipated to the substrate by the heat source, over a part of a surface of the substrate. The cooling element dissipates the distributed heat to the heat sink that is thermally coupled with the substrate.