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Controlled Solder Self-alignment Sequence for an Optoelectronic Module without Mechanical Stops

机译：无机械停止的光电模块的受控焊料自对准序列

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Morozova Liew Zhang; N. D. Morozova; L. -a. Liew; W. Zhang; R. Irwin; Bingzhi Su; Y. C. Lee;
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年度 2007
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1. Influences of Solder Wetting on Self-Alignment Accuracy and Modeling for Optoelectronic Devices Assembly [J] . Ming Kong, Sungeun Jeon, Chiwon Hwang, Journal of Electronic Packaging . 2012,第2期

机译：焊料润湿对光电器件组装的自对准精度和建模的影响
2. Cell interconnection without glueing or soldering for crystalline Si photovoltaic modules [J] . Johann Summhammer, Zahra Halavani EPJ Photovoltaics . 2016,第1期

机译：晶体硅光伏模块的电池互连，无需胶合或焊接
3. Numerical and Experimental Analysis of Solder Joint Self-Alignment in Fiber Attachment Soldering [J] . Wei Zhang, Chunqing Wang, Yanhong Tian Journal of Electronic Packaging . 2008,第1期

机译：光纤固焊中焊点自对准的数值与实验分析
4. Controlled solder self-alignment sequence for an optoelectronic module without mechanical stops [C] . Morozova, N.D., Liew, Electronic Components and Technology Conference, 1997. Proceedings., 47th . 1997

机译：无机械挡块的光电模块的受控焊料自对准顺序
5. Experimental and modeling studies on solder self-alignment for optoelectronic packaging. [D] . Kong, Ming. 2012

机译：用于光电包装的焊料自对准的实验和建模研究。
6. The Role of Intermetallic Compounds in Controlling the Microstructural Physical and Mechanical Properties of Cu-Sn-Ag-Cu-Bi-Cu Solder Joints [O] . Reza Sayyadi, Homam Naffakh-Moosavy -1

机译：金属间化合物在控制Cu- Sn-Ag-Cu-Bi-Bi -Cu钎焊接头的微结构物理和力学性能中的作用
7. Cell interconnection without glueing or soldering for crystalline Si photovoltaic modules [O] . Johann Summhammer, Zahra Halavani 2016

机译：用于粘合或焊接的细胞互连用于晶体Si光伏模块

Controlled Solder Self-alignment Sequence for an Optoelectronic Module without Mechanical Stops

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