首页> 外文OA文献 >A high-aspect ratio silicon substrate-via technology and applications: Through-wafer interconnects for power and ground and Faraday cages for SOC isolation

【2h】

A high-aspect ratio silicon substrate-via technology and applications: Through-wafer interconnects for power and ground and Faraday cages for SOC isolation

机译：高纵横比硅衬底 - 通孔技术和应用：用于电源和接地的贯穿晶圆互连以及用于sOC隔离的法拉第笼

页面导航

著录项
相似文献
相关主题

著录项

作者
Joyce H. Wu; Jesds A. Del Alamo; Keith A. Jenkins;
展开▼
作者单位

展开▼
年度 2008
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Through-wafer interconnect technology for silicon [J] . Kutchoukov VG, Shikida M, Mollinger JR, Journal of Micromechanics and Microengineering . 2004,第7期

机译：硅晶圆直通互连技术
2. Electroplated Metal Buried Interconnect and Through-Wafer Metal-Filled Via Technology for High-Power Integrated Electronics [J] . Chang-Hyeon Ji, Herrault F., Hopper P., Advanced Packaging, IEEE Transactions on . 2009,第3期

机译：用于大功率集成电子产品的电镀金属埋入互连和晶圆通孔金属填充通孔技术
3. Mapping stresses in high aspect ratio polysilicon electrical through-wafer interconnects [J] . Himani Sharma, Joshua D. Krabbe, Samira Farsinezhad, Journal of microanolithography, MEMS, and MOEMS . 2015,第2期

机译：高深宽比多晶硅电气直通晶圆互连中的映射应力
4. A high aspect-ratio silicon substrate-via technology and applications: through-wafer interconnects for power and ground and Faraday cages for SOC isolation [C] . Wu, J.H., Del Alamo, Electron Devices Meeting, 2000. IEDM Technical Digest. International . 2000

机译：高纵横比的硅基板通过技术和应用：用于电源和接地的晶圆互连以及用于SOC隔离的法拉第笼
5. Three-dimensional silicon-on-insulator BiCMOS technologies with excellent cross-talk isolation for RF system-on-a-chip (SOC) applications. [D] . Mahender, Kumar. 2001

机译：具有出色串扰隔离功能的三维绝缘体上硅BiCMOS技术，适用于RF片上系统（SOC）应用。
6. Coumarins as Powerful Photosensitizers for the Cationic Polymerization of Epoxy-Silicones under Near-UV and Visible Light and Applications for 3D Printing Technology [O] . Mira Abdallah, Akram Hijazi, Frédéric Dumur, 2020

机译：香豆素作为近UV和可见光下的环氧树脂阳离子聚合的强大光敏光以及用于3D印刷技术的应用
7. A high aspect-ratio silicon substrate-via technology and applications [O] . Wu Joyce H. (Joyce Hsia-Sing) 1974- 2000

机译：高纵横比硅衬底 - 通孔技术和应用

A high-aspect ratio silicon substrate-via technology and applications: Through-wafer interconnects for power and ground and Faraday cages for SOC isolation

著录项

相似文献

相关主题

期刊订阅