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Au enrichment and vertical relaxation of the Cu$_{3}$ Au ( 111 ) surface studied by normal-incidence x-ray standing waves

机译:通过垂直入射x射线驻波研究Cu $ _ {3} $ Au(111)表面的Au富集和垂直弛豫

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摘要

We have investigated the Cu3Au(111) surface, prepared under ultrahigh vacuum conditions by sputtering and annealing, by low energy electron diffraction (LEED), scanning tunneling microscopy (STM), x-ray photoelectron spectroscopy, and normal incidence x-ray standing waves (NIXSW). We find the surface to be depleted with Cu and enriched with Au at the same time, yielding a nominal Cu:Au ratio of 0.61:0.39 in the topmost layer. The STM images reveal that the first layer is nearly closely filled with atoms and contains a small amount of vacancies with an area concentration of about 5%. Together with the Au enrichment, these cause local short-range disorder of the Au p(2×2) reconstruction. From this data, the average stoichiometry of the p(2×2) surface unit cell is estimated at Cu2.22Au1.44□0.20 (instead of Cu3.00Au1.00□0.00 of the ideal surface; □ denotes an atomic vacancy site). From NIXSW we find a significant outward relaxation of both the Cu and Au atoms of the topmost layer by 0.28 Å and 0.33 Å, which corresponds to 13% and 15% of the (111) bulk layer spacing of Cu3Au. We suggest that this originates from a widening of the first/second layer spacing, by 6.8% and 8.8% for the Cu and Au atoms, respectively, plus an additional rigid increase in the second/third layer spacing by 6.2%. We explain this by steric repulsions between Au atoms of the topmost layer, replacing smaller Cu atoms, and Au atoms in the second layer in combination with disorder. Finally, a lateral reconstruction, similar to that on the Au(111) surface, but with a much larger periodicity of 290 Å, is identified from LEED.
机译:我们研究了通过溅射和退火,低能电子衍射(LEED),扫描隧道显微镜(STM),X射线光电子能谱和法向入射X射线驻波在超高真空条件下制备的Cu3Au(111)表面(NIXSW)。我们发现表面同时贫化了铜,同时富集了金,在最顶层产生的名义铜与金之比为0.61:0.39。 STM图像显示,第一层几乎充满原子,并且包含少量空孔,其面积浓度约为5%。这些与Au富集一起会导致Au p(2×2)重建的局部短程无序。根据该数据,估计p(2×2)表面晶胞的平均化学计量为Cu2.22Au1.44□0.20(而不是理想表面的Cu3.00Au1.00□0.00;□表示原子空位) 。从NIXSW,我们发现最顶层的Cu和Au原子向外显着弛豫了0.28Å和0.33Å,分别相当于Cu3Au(111)本体层间距的13%和15%。我们认为,这是由于第一/第二层间距的扩大所致,分别为Cu和Au原子的6.8%和8.8%,以及第二/第三层间距的另外的刚性增加6.2%。我们用最顶层的Au原子之间的空间排斥来解释这一点,取代较小的Cu原子,而第二层中的Au原子与无序结合。最后,从LEED中识别出了横向重建,类似于Au(111)表面的横向重建,但具有290Å的大得多的周期性。

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