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Study on the electroforming and resistive switching behaviour of nickel oxide thin films for non-volatile memory applications

机译:非易失性存储应用中氧化镍薄膜的电铸和电阻转换行为研究

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摘要

Over the past decade, the resistance switching effect has drawn attention withinthe scientific community as a potential candidate for non-volatile random accessmemories (RAM) and crossbar logic concepts. The resistance switching memorycells are based on (at least) two well-defined non-volatile resistance states, e.g.,high resistance state (HRS) and low resistance state (LRS), that define two (ormore) logic memory states, e.g., 1 or 0. Often these cells have a simple capacitorstructure and are therefore easy to fabricate. However, the market launch ofRRAMs is hindered by several serious obstacles. For example, the underlyingmicroscopical physical and chemical switching mechanism of RRAM devicesis still under debate although various models have been proposed to explainthe observed phenomena. By missing a deep understanding of the resistiveswitching eect on an atomistic scale, a reliable fabrication of predictable andwell performing Gbit memory seems to be questionable.This thesis is an attempt to develop and physically understand the nickel oxide(NiO) based resistive switching non-volatile memory devices. Although theunderlying microscopical switching mechanism is still under debate, the macroscopicswitching mechanism of this material system is often described by thecreation and rupture of well-conducting nickel flaments embedded within aninsulating NiO matrix, the so called fuse-antifuse mechanism. The resistiveswitching characteristics, essentials for future non-volatile memories, such aslow voltage and current operation with high resistance ratio between HRS andLRS, fast switching speed, high retention and endurance are presented.Additionally, the emphasis is layed on the understanding of the so called formingprocess. It describes the first resistance transition of the resistive switchingdevice in which the proposed nickel flament is formed. Therefore, it is the keyprocess for understanding the resistive switching phenomena. The statistical distributionof the observed forming process is studied under accelerated constantvoltage stress conditions and at varying temperatures within the framework ofthe Weibull statistics.To understand the physical and chemical nature of the flamentary structure,the inuence of different ambient atmospheres and temperatures on the formingprocess is analyzed electrically as well as chemically by XPS analysis. Combiningthese results with the results of the potentiostatic breakdown studies, a modelfor the forming process in Pt/NiO/Pt non-volatile resistive switching memorydevices is proposed.
机译:在过去的十年中,电阻转换效应作为非易失性随机存取存储器(RAM)和交叉开关逻辑概念的潜在候选者已经引起了科学界的关注。电阻切换存储单元基于(至少)两个定义良好的非易失性电阻状态,例如高电阻状态(HRS)和低电阻状态(LRS),它们定义了两个(或多个)逻辑存储状态,例如1或0。这些电池通常具有简单的电容器结构,因此易于制造。但是,RRAM的市场推出受到一些严重障碍的阻碍。例如,尽管已经提出了各种模型来解释观察到的现象,但是RRAM设备的潜在微观物理和化学转换机制仍在争论中。由于缺少对原子尺度的电阻开关效应的深入了解,可靠的可预测且性能良好的Gbit存储器的制造似乎值得怀疑。本论文旨在开发并物理理解基于氧化镍(NiO)的电阻开关非易失性存储设备。尽管底层的微观转换机制仍在争论中,但这种材料系统的宏观转换机制通常是通过嵌入绝缘的NiO基质中的导电性良好的镍细屑的产生和破裂来描述的,即所谓的熔体-反熔丝机制。提出了电阻开关特性,未来的非易失性存储器的基本要求,例如低电压和电流操作以及HRS和LRS之间的高电阻比,快速的开关速度,高的保持力和耐用性。此外,重点在于对所谓的开关的理解。成型过程。它描述了其中形成了所提出的镍火焰的电阻开关装置的第一电阻过渡。因此,这是理解电阻开关现象的关键过程。在Weibull统计框架内研究了在加速恒压应力条件下以及在不同温度下观察到的成形过程的统计分布。为了了解火焰状结构的物理和化学性质,分析了不同环境气氛和温度对成形过程的影响通过XPS分析进行电学和化学分析。将这些结果与恒电位击穿研究的结果相结合,提出了Pt / NiO / Pt非易失性电阻开关存储器件的形成过程模型。

著录项

  • 作者

    Weng Robert;

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  • 年度 2015
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  • 原文格式 PDF
  • 正文语种 eng
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