Fast and Scalable Fabrication of Microscopic Optical Surfaces and its Application for Optical Interconnect Devices

摘要

The use of optical interconnects is a promising solution to the increasing demand for high speed mass data transmission used in integrated circuits as well as device to device data transfer applications. For the purpose, low cost polymer waveguides are a popular choice for routing signal between devices due to their compatibility with printed circuit boards. In optical interconnect, coupling from an external light source to such waveguides is a critical step, thus a variety of couplers have been investigated such as grating based couplers [1,2], evanescent couplers [3], and embedded mirrors [4–6].udThese couplers are inherently micro-optical components which require fast and scalable fabrication for mass production with optical quality surfaces/structures. Low NA laser direct writing has been used for fast fabrication of structures such as gratings and Fresnel lenses using a linear laser direct writing scheme, though the length scale of such structures are an order of magnitude larger than the spot size of the focused laser of the tool. Nonlinear writing techniques such as with 2-photon absorption offer increased write resolution which makes it possible to fabricate sub-wavelength structures as well as having a flexibility in feature shape. However it does not allow a high speed fabrication and in general are not scalable due to limitations of speed and area induced by the tool’s high NA optics. udTo overcome such limitations primarily imposed by NA, we propose a new micro-optic fabrication process which extends the capabilities of 1D, low NA, and thus fast and scalable, laser direct writing to fabricate a structure having a length scale close to the tool's spot size, for example, a mirror based and 45 degree optical coupler with optical surface quality.udThe newly developed process allows a high speed fabrication with a write speed of 2600 mm²/min by incorporating a mask based lithography method providing a blank structure which is critical to creating a 45 degree slope to form the coupler surface. In this method, instead of using an entire exposure in a pixelated manner, only a portion of the Gaussian profile is used, allowing a reduced surface roughness and better control of the surface shape than previously possible with this low NA beam. The surface figure of the mirror is well controlled below 0.04 waves in root-mean-square (RMS) at 1.55 μm wavelength, with mirror angle of 45±1 degrees.udThe coupling efficiency is evaluated using a set of polymer waveguides fabricated on the same substrate as the complete proof of concept device. Device insertion loss was measured using a custom built optical test station and a detailed loss analysis was completed to characterize the optical coupling efficiency of the mirror. Surface roughness and angle were also experimentally confirmed. This process opens up a pathway towards large volume fabrication of free-form and high aspect ratio optical components which have not yet pursued, along with well-defined optical structures on a single substrate. udIn this dissertation, in Chapter 1, we provide an overview of optical surface fabrication in conjunction with current state of the art on fabrication of free form surfaces in macro and microscopic length scale. The need for optical interconnects is introduced and fabrication methods of micro-optical couplers are reviewed in Chapter 2. In Chapter 3, the complete fabrication process of a mirror based coupler is presented including a custom alignment procedure. In Chapter 4, we provide the integration procedure of the optical couplers with waveguides. In Chapter 5, the alignment of two-lithographic methods is discussed. In Chapter 6, we provide the fabrication procedure used for the waveguides. In Chapter 7, the experimental evaluation and testing of the optical coupler is described. We present a custom test station used for angle verification and optical coupler efficiency measurement. In Chapter 8, a detailed loss analysis of the device is presented including suggestions for future reductions in loss. Conclusions and future work considerations are addressed in Chapter 9.