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Current gain degradation in bipolar junction transistors due to radiation, electrical and mechanical stresses

机译:由于辐射,电气和机械应力,双极结型晶体管的电流增益降低

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摘要

The current gain of bipolar junction transistors is reduced due to ionizing radiation exposure or hot-carrier stressing. Radiation-induced degradation is particularly severe at the low dose rates encountered in space. In this work, the dose rate effect in lateral and substrate pnp bipolar transistors is rigorously quantified over the range of 0.001 to 294 rad(Si)/s. Gain degradation shows little dependence on dose rate below 0.005 rad(Si)/s, suggesting that degradation enhancement comparable to that expected from space-like dose rates was achieved. In addition, the effect of ambient temperature on radiation-induced gain degradation at 294 rad(Si)/s is thoroughly investigated over the range of 25 to 240°C. Degradation is enhanced with increasing temperature while simultaneously being moderated by in situ annealing such that, for a given total dose, an optimum irradiation temperature for maximum degradation results. Optimum irradiation temperature decreases logarithmically with total dose and is larger and more sensitive to dose in the substrate device than in the lateral device. Maximum high dose rate degradation at elevated temperature closely approaches low dose rate degradation in both of the devices. A flexible hardness assurance methodology based on accelerated irradiations at elevated temperatures is described. The influence of mechanical stress on the radiation hardness of single-crystalline emitter transistors is investigated using x-ray diffraction. Correlation of device radiation sensitivity and mechanical stress in the base supports previously reported observations that Si-SiO₂ interfaces exhibit increased susceptibility to radiation damage under tensile Si stress. Relaxation of processing-induced stress in the base oxide due to ionizing radiation is smaller than the stress induced by emitter contact metallization followed by a post-metallization anneal. Possible mechanisms for radiation-induced stress relaxation and their effect on the radiation sensitivity of bipolar transistors are discussed. The combined effects of ionizing radiation and hot-carrier stress on the current gain of npn transistors are investigated. The hot-carrier response of the transistors is improved by radiation damage, whereas hot-carrier damage has little effect on subsequent radiation stress. Characterization of the temporal progression of hot-carrier effects reveals that hot-carrier stress acts initially to reduce excess base current and improve current gain in irradiated transistors. Numerical simulations show that the magnitude of the peak electric-field within the emitter-base depletion region is reduced significantly by net positive oxide charges induced by radiation. The interaction of the two stress types is explained in a physical model based on the probability of hot-carrier injection and the neutralization and compensation of radiation damage in the base oxide. The results of this work further the understanding of stress-induced gain degradation in bipolar transistors and provide important insight for the use of bipolar transistors in stress environments.
机译:由于电离辐射暴露或热载流子应力,双极结型晶体管的电流增益降低。在太空中遇到的低剂量率,辐射引起的降解特别严重。在这项工作中,横向和衬底pnp双极晶体管中的剂量率效应在0.001至294 rad(Si)/ s的范围内严格量化。增益衰减显示低于0.005 rad(Si)/ s的剂量率几乎没有依赖性,这表明可实现与空间剂量率预期的衰减增强相当的衰减增强。此外,在25到240°C的温度范围内,研究了环境温度对294 rad(Si)/ s的辐射引起的增益衰减的影响。降解随着温度的升高而增强,同时通过原位退火得以缓和,从而对于给定的总剂量,可得到最佳的照射温度以实现最大的降解。最佳照射温度与总剂量成对数关系,并且比侧面设备更大,并且对衬底设备的剂量更敏感。在两个装置中,高温下的最大高剂量率降解都非常接近低剂量率降解。描述了基于在高温下加速照射的灵活的硬度保证方法。使用X射线衍射研究了机械应力对单晶发射极晶体管的辐射硬度的影响。基座中器件辐射敏感性和机械应力的相关性支持先前报道的观察结果,即Si-SiO 2界面在拉伸Si应力下对辐射损伤的敏感性增加。由于电离辐射,基体氧化物中由加工引起的应力的松弛小于由发射极接触金属化之后进行的后金属化退火引起的应力。讨论了辐射引起的应力松弛的可能机制及其对双极晶体管辐射敏感性的影响。研究了电离辐射和热载流子应力对npn晶体管电流增益的综合影响。晶体管的热载流子响应可通过辐射损伤得到改善,而热载流子损伤对随后的辐射应力影响很小。热载流子效应随时间变化的特征表明,热载流子应力起初作用是减少多余的基极电流并改善辐照晶体管的电流增益。数值模拟表明,辐射引起的净正氧化正电荷显着降低了发射极-基极耗尽区内峰值电场的强度。基于热载流子注入的可能性以及中和和补偿基础氧化物中辐射损伤的可能性,在物理模型中解释了两种应力类型的相互作用。这项工作的结果进一步了解了双极型晶体管中应力引起的增益下降,并为在应力环境中使用双极型晶体管提供了重要的见识。

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