Silver sintering is used to bond five components together, in order to form a piezoelectric sensor. A description is provided of the preparation of these components, and of the manufacturing steps, which are carried out at a low temperature (280 °C).udududThe resulting sensor assemblies are then characterized: cross-sectional views show that the silver layer has a very dense struc-ture, with less than 1 % porosity, although further focused-ion beam investigations show that this porosity is closer to 15 %. The shear strength is approximately 30 MPa. The Young's modulus of the silver bondline is measured using nanoindentation, and is found to be comparable with that of bulk silver (56.6 GPa). Finally, a silver-sintered sensor is compared with a sensor bonded using conventional techniques, showing that an improvement in sensitivity by a factor of more than 3 is achieved.
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机译：银烧结用于将五个组件粘合在一起，以形成压电传感器。提供了在低温（280°C）下进行的这些组件的制备和制造步骤的说明。 ud ud ud随后表征了所得的传感器组件：剖视图显示：银层具有非常致密的结构，孔隙率小于1％，尽管进一步的聚焦离子束研究表明该孔隙率接近15％。剪切强度约为30MPa。使用纳米压痕法测量了银键合线的杨氏模量，发现该杨氏模量与块状银（56.6 GPa）相当。最后，将银烧结传感器与使用常规技术粘合的传感器进行了比较，显示出灵敏度提高了3倍以上。
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