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New Materials and Methods for the Fabrication of Large-Area Stretchable Electronics

机译:大面积可伸缩电子器件的新材料和制造方法

摘要

This dissertation addresses three main challenges towards the fabrication of large-area stretchable electronic devices. First, we replaced expensive photolithography techniques with low-cost methods to achieve highly stretchable gold films on elastomers. Second, we enabled the fabrication of large-area stretchable pixels through the incorporation of stretchable elastomers in the emissive layer of light-emitting devices. Third, we made progress towards theinception of air-stable large-area stretchable electronics by developing methods to deposit conductive metal films on new highly impermeable stretchablesubstrates.Chapter 2 describes the deposition of a low-cost, microstructured glue interlayer on an elastomeric substrate to enable the fabrication of gold films with high stretchability for use as device interconnects and strain sensors. The microstructured glue interlayer is low-cost, commercially available and green and can be deposited by benchtop fabrication processes eliminating the need for expensive photolithographic patterning techniques to achieve stretchable metal geometries.Chapter 3 expands upon the work of Chapter 2 to develop a poly(vinyl alcohol) polymer interlayer whose tunable mechanical properties affect the crack propagation in overlying metal films. When the polymer is dry, it is a brittle film that cracks under strain and causes metal films to fail electrically at low elongations. After exposure to water condensation the polymer interlayer softens and a wrinkled topography develops which enables gold films to stretch to 75% elongation before failure occurs.Chapter 4 reports the development of an elastomeric emissive material capable of withstanding strains up to 27% before light emission is no longer observed. This is the first example of a room-temperature stretchable large-area light-emitting device.Chapter 5 builds upon the work of Chapter 4 by incorporating graft copolymers with increased air and moisture permeability into the emissive layer. We demonstrate that the graft copolymers provide greater device stability than the elastomer reported in Chapter 3 and can sustain repeated cyclic strains without influencing the peak radiance.Chapter 6 presents methods to enable the deposition of conductive metal films on elastomers with high impermeability to water and oxygen. This is the first step to realizing commercial stretchable electronic devices capable of ambient operation.
机译:本文针对大面积可拉伸电子设备的制造面临三个主要挑战。首先,我们用低成本的方法代替了昂贵的光刻技术,从而在弹性体上获得了高度可拉伸的金膜。其次,我们通过在发光器件的发射层中加入可拉伸的弹性体,来制造大面积的可拉伸像素。第三,我们通过开发在新的高度不可渗透的可拉伸基底上沉积导电金属膜的方法,在空气稳定的大面积可拉伸电子学方面取得了进展。第二章介绍了在弹性体基底上沉积低成本,微结构化胶层的方法高拉伸性金膜的制造,用作设备互连和应变传感器。该微结构胶粘剂中间层是低成本的,可商购的并且是绿色的,并且可以通过台式制造工艺进行沉积,从而无需昂贵的光刻图案技术来实现可拉伸的金属几何形状。第3章在第2章的工作基础上进行了扩展,以开发聚乙烯基醇)聚合物夹层,其可调的机械性能会影响上覆金属膜中的裂纹扩展。当聚合物干燥时,它是脆性膜,在应力作用下破裂,并导致金属膜在低伸长率下发生电失效。暴露于水的凝结后,聚合物夹层软化,形成皱纹的形貌,使金膜在失效发生前可拉伸至75%的伸长率。第4章报道了在发光前可承受高达27%应变的弹性体发光材料的发展。不再观察。这是室温可拉伸大面积发光器件的第一个示例。第五章以第四章的工作为基础,将具有增加的透气性和透湿性的接枝共聚物掺入发光层中。我们证明了接枝共聚物比第3章中报道的弹性体具有更高的装置稳定性,并且可以承受重复的循环应变而不会影响峰值辐射率。第6章介绍了使导电金属膜能够在对水和氧具有高度不渗透性的弹性体上沉积的方法。这是实现能够在环境下运行的商用可伸展电子设备的第一步。

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  • 作者

    Filiatrault Heather Lynn;

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  • 年度 2015
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  • 原文格式 PDF
  • 正文语种 en
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