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Soudure de pieces métalliques par diffusion d'une phase liquide transitoire

机译:通过瞬态液相扩散焊接金属零件

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摘要

The main scientific activities carried out in this thesis includes: The structural characterization by X-Ray diffraction (XRD), microstructure analysis by electron microscopy (SEM and EBSD), chemical analysis (EDS and EPMA) and mechanical testing - tensile and hardness tests - of the joints of bonded carbon steel parts by means of the Transient Liquid Phase Bonding (TLPB) process, using as filler materials amorphous ribbons of Fe-B and Fe-Si-B systems, and Cu foils.The TLPB bonded joints were obtained by heating the assembly to a temperature of 1300ºC, which is maintained for 7 min, at the same time a pressure of 5 MPa is applied.The results obtained both by SEM and EBSD show that when amorphous Fe-Si-B ribbons are used as filler material, at the joint of the bonded parts a microstructure consisting of ferrite grains is observed, in contrast with ferritic-pearlitic microstructure at the heat affected zone (HAZ).The ferrite grains at the joint are not generally shared with those of the HAZ, and are clearly delimited by grain boundaries. The composition profiles obtained both by EDS and EPMA show that the joint is enriched in Si and is depleted in Mn. During cooling, this microsegregation of Mn and Si produced by the TLPB makes the joint a region where ferrite is formed prematurely at austenite grains boundaries of the HAZ. Afterwards, the austenite of the HAZ transforms to form a ferritic/pearlitic microstructure, which contrasts with that of the joint. The tensile tests of specimens from the bonded parts show that the fracture occurs in the HAZ, far from the junction. Hardness measurements both at the joint and at the HAZ are consistent with the observed microstructures.A complementary study at the joint was carried out where the isothermal solidification completion was not achieved. During cooling, at a first stage the phase which solidifies is the same than that during the TLPB process. Finally, the appearance of other phases takes place. The metastable phase Fe23B6 was detected by X-Ray microdiffraction (ID27, ESRF at Grenoble).When amorphous Fe-B ribbons are used as filler material, there is no clear distinction between the microstructure at the joint and at the HAZ. The ferrite grains at the joint are shared with those of the HAZ, and epitaxial solidification of these grains can be visualized from the grains of the HAZ.When tensile tested, the bonded parts attain at least 88% of the ultimate tensile strength (UTS) of the base metal. In this case, fracture occurred at the joint, although the values of hardness correspond to those expected for the observed microstructures.Finally, when Cu foils are used as filler material, the microstructure observed at the joint is similar to that of the HAZ. Close to the outer surface, porosity due to Kirkendall effect is observed (the Cu of the joint diffuses into the base metal faster than the Fe into the joint, which generates a flow of vacancies towards the joint, thus developing porosity). This effect is less pronounced (less porosity) away from the outer surface where the pressure at the joint is larger. This indicates the high sensitivity of the Kirkendall effect with pressure. The tensile test shows that the joint attains at least 85% of the UTS of the base metal, and that it fails at the joint. The latter is related to the abundance of secondary phases due to an incomplete isothermal solidification (these areas - with lower strength compared with the base metal - fail before under traction, which reduces the effective area during the test, resulting in an overload failure). Hardness measurements at the joint and at the HAZ are consistent with the observed microstructres.
机译:本论文进行的主要科学活动包括:X射线衍射(XRD)的结构表征,电子显微镜(SEM和EBSD)的微观结构分析,化学分析(EDS和EPMA)以及机械测试-拉伸和硬度测试-通过过渡液相键合(TLPB)工艺对碳钢零件的接头进行焊接,使用Fe-B和Fe-Si-B系统的非晶带和铜箔作为填充材料。将组件加热到1300ºC,并保持7分钟,同时施加5 MPa的压力。通过SEM和EBSD获得的结果表明,当使用非晶态Fe-Si-B薄带作为填料时与热影响区(HAZ)的铁素体-珠光体组织相反,在结合部分的接头处观察到了由铁素体晶粒组成的显微组织。 HAZ,并且明显受晶界限制。通过EDS和EPMA获得的组成曲线表明,该接头富含Si,而Mn却缺乏。在冷却过程中,由TLPB产生的Mn和Si的微偏析使接头成为HAZ的奥氏体晶粒边界处过早形成铁素体的区域。然后,热影响区的奥氏体转变成铁素体/珠光体的显微组织,与接头的相反。从结合部分进行的样品拉伸试验表明,断裂发生在热影响区,距离接合处较远。接头处和热影响区的硬度测量值与观察到的显微组织一致。在接头处进行的补充研究未达到等温凝固完成。在冷却期间,第一阶段的固化阶段与TLPB过程中的阶段相同。最后,出现其他阶段。通过X射线微衍射(ID27,格勒诺布尔的ESRF)检测到亚稳相Fe23B6。当使用非晶态Fe-B带作为填充材料时,接头和热影响区的微观结构没有明显区别。接头处的铁素体晶粒与热影响区共享,并且可以从热影响区的晶粒中看到这些晶粒的外延凝固,在进行拉伸测试时,粘结的零件至少达到极限拉伸强度(UTS)的88%贱金属。在这种情况下,尽管硬度值与所观察到的显微组织的预期值一致,但在接头处仍发生断裂。最后,当使用铜箔作为填充材料时,在接头处观察到的显微组织与HAZ相似。靠近外表面,观察到由于柯肯达尔效应而产生的孔隙度(接头中的铜扩散到母材中的速度比Fe进入接头中的扩散快,从而产生了向接头的空位流,从而形成了孔隙)。远离接头处压力较大的外表面,这种影响不太明显(孔隙率较小)。这表明柯肯德尔效应对压力的高度敏感性。拉伸测试表明,该接头至少达到母材UTS的85%,并且在接头处失效。后者与由于不完全等温凝固而导致的第二相的丰度有关(这些区域(与母材相比强度较低的区域)在牵引之前会失效,这会降低测试期间的有效面积,从而导致过载失效)。接头和热影响区的硬度测量值与观察到的微结构一致。

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    Di Luozzo Nicolás;

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  • 年度 2014
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