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Preparation of Ni–YSZ thin and thick films on metallic interconnects as cell supports. Applications as anode for SOFC

机译:在金属互连上作为电池载体制备Ni-YSZ薄膜和厚膜。用作SOFC的阳极

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摘要

In this work, we propose the preparation of a duplex anodic layer composed of both a thin (100 nm) and a thick film (10 lm) with Ni–YSZ material. The support of this anode is a metallic substrate, which is the interconnect of the SOFC unit cell. The metallic support limits the temperature of thermal treatment at 800 C to keep a good interconnect mechanical behaviour and to reduce corrosion. We have chosen to elaborate anodic coatings by sol–gel route coupled with dip-coating process, which are low cost techniques and allow working with moderate temperatures. Thin films are obtained by dipping interconnect substrate into a sol, and thick films into an optimized slurry. After thermal treatment at only 800 C, anodic coatings are adherent and homogeneous. Thin films have compact microstructures that confer ceramic protective barrier on metal surface. Further coatings of 10 lm thick are porous and constitute the active anodic material.
机译:在这项工作中,我们建议使用Ni-YSZ材料制备由薄(100 nm)和厚膜(10 lm)组成的双阳极层。该阳极的支撑是金属基板,它是SOFC单元电池的互连。金属支撑将热处理温度限制在800°C,以保持良好的互连机械性能并减少腐蚀。我们选择通过溶胶-凝胶途径结合浸涂工艺来制作阳极涂层,这是一种低成本技术,可以在中等温度下进行。通过将互连基板浸入溶胶中,然后将厚膜浸入优化的浆料中,可以得到薄膜。仅在800℃下进行热处理后,阳极涂层便会粘附且均匀。薄膜具有致密的微观结构,可在金属表面赋予陶瓷保护层。 10 lm厚的其他涂层是多孔的,构成了活性阳极材料。

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