The market demands for higher pin counts and more chips functionality poses challenges inudconventional wire bonding. However, the novel insulated Cu wire technology enables fine and ultra fine pitchudwire bonding as the insulator coating on the bare wire prevents wires shorting problem. This paper present studyudon the stitch bonding process optimization and its challenges for the insulated Cu wire with the diameter of 20udurn. Insulated Cu stitch bond samples showed 37 % lowe: stitc~ pull s~rength than that of bare Cu. The crosssectionedudinsulated Cu stitch bond shows that there are insulation residue between the Cu stitch and the Auudplated substrate, potentially resulting low.er stitch pull p~rformance. H~wever, after isothermal aging at 225 DCudup to 78 hours, the stitch pull results for Insulated Cu WIfe passed the Industry reliability standard, without anyudlifted bond. A detailed comparison study was performed for the Insulated Cu and the bare Cu stitch bonding.
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机译：市场对更高的引脚数和更多的芯片功能的需求对传统的引线键合提出了挑战。但是，由于裸线上的绝缘体涂层可防止导线短路问题，因此新颖的绝缘Cu线技术可实现精细和超精细的间距 udwire键合。本文对直径为20毫米的绝缘铜线的针脚焊接工艺优化及其挑战进行了研究。绝缘的铜缝粘结样品显示出37％的降低：静态拉伸强度比裸铜低。横截面/未绝缘的铜针脚粘结表明，在铜针脚和镀金的基底之间存在绝缘残留物，可能导致较低的针脚拉性能。但是，在225 DC udup等温老化达78小时后，绝缘Cu WIfe的针拔结果通过了行业可靠性标准，没有任何粘结。对绝缘铜和裸铜针脚键合进行了详细的比较研究。
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