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Effect of Different S AC Based Nanoparticles Types on the Reflow Soldering Process of Miniaturized Component using Discrete Phase Model Simulation

机译：不同SAc基纳米粒子类型对使用离散相模模拟的小型化组分回流焊接过程的影响

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M. A. Fatah M. Mukhtar; A. Abas; M. S. Haslinda; F. Che Ani; A. Jalar; A. A. Saad; M. Z. Abdullah; R. Ismail;
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2. Microstructure and mechanical properties of Pb-free Sn-3.0Ag-0.5Cu solder pastes added with NiO nanoparticles after reflow soldering process [J] . Srivalli Chellvarajoo, M.Z. Abdullah Materials & design . 2016,第JANa期

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4. Simulation of droplet deposition process in multi-layer ultrasonic aeroponic cultivator based on CFD discrete phase model [C] . Jingyu Zhang, Jianmin Gao, Guizhen Huang Annual International Meeting of the American Society of Agricultural and Biological Engineers . 2014

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5. Implementation and qualification of a prototype tester for reflow soldering process compatibility evaluation of surface -mount technology components [D] . Wong, Anthony Yin-Bong 2002

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6. Soldering of Passive Components Using Sn Nanoparticle Reinforced Solder Paste: Influence on Microstructure and Joint Strength [O] . Anas M. Atieh, Tala J. Abedalaziz, Abdulaziz AlHazaa, 2019

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7. Study on the Addition of Nanoparticles in the Lead-free Solder During Reflow Soldering via Numerical Simulation - A Review [O] . Intan Norshalina Sahrudin, Mohd Sharizal Abdul Aziz, Mohd. Zulkifly Abdullah, 2020

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Effect of Different S AC Based Nanoparticles Types on the Reflow Soldering Process of Miniaturized Component using Discrete Phase Model Simulation

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