Development of a Method To Accomplish Aluminum Deposition by Gas Plating

摘要

The deposition of aluminum was accomplished by thermally decomposing vapors of tri-isobutyl aluminum on the surface of cleaned, heated copper test panels in a heated plating chamber.nThe test panels were subjected to a preliminary deoxidation by induction heating to 800°P in a hydrogen atmosphere, purging the chamber with argon gas while cooling the sample to 500 degrees, then admitting a mix¬ture of gases containing tri-isobutyl aluminum vapors for varying periods.nThe plate produced is substantially pure alum¬inum, lustrous and ductile, of excellent conductivity, and in thickness up to 4.7 mils. Adhesion varied from poor to excellent.