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The Adsorption of Cu (II) at the Solid-Solution Interface Effect of Complex Formation

机译:Cu(II)在固溶界面吸附对络合物形成的影响

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摘要

Results are presented of a study investigating how and under what conditions complexation influences the adsorptive behavior of heavy metals at the solid-solution interface. The mechanism of interfacial adsorption processes is emphasized. The significance of complexation and the associated changes in solution specification in relation to metal adsorption is reviewed and with special attention to hydrolysis. The theoretical basis for ionic equilibria calculations essential to adsorption data interpretation is outlined. Adsorption characteritics of complexed Cu(II) species onto various oxide and zeolite surfaces are presented and the effect of hydrophobicity is examined. It is determined that combining a metal ion with an organic ligand in an aqueous solution can give rise to significant changes in the physical, chemical, and electrical properties of the metal. Unless the ligand is uncharged, complexation will alter the magnitude and/or sign of the metal ionic charge.

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