Flexible Substrate for Printed Wiring

机译：用于印刷线路的柔性基板

获取原文

页面导航

摘要
著录项
引文网络
相似文献
相关主题

摘要

A very flexible substrate for printed wiring is disclosed which is composed of a blend of phenoxy resin-polyisocyanate-brominated epoxy resin in which the equivalent ration of the functional groups is hydroxyl grouped: isocyanate group: epoxy group = 1:0.2 to 2:0.5 to 3. The product has outstanding solder resistance and is applied to metal without using adhesives.

著录项

作者
Asakura, M.; Yabe, K.; Tanaka, H.; Soda, A.;
展开▼
作者单位

展开▼
年度 1982
页码 p.1-15
总页数 15
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
Electronic packaging; Flexibility; Printed circuits; Substrates; Thermosetting resins; Coating; Crosslinking; Epoxy resins; Isocyanates; Patent policy; Soldering;

机译：电子封装;柔韧性;印刷电路;基板;热固性树脂;涂层;交联;环氧树脂;异氰酸酯;专利政策;焊接;

相似文献

外文文献
中文文献
专利

1. Substrate-induced coagulation of carbon black on gelatine-modified printed wiring board surfaces Part 1. Gelatine adsorption on to printed wiring board surfaces [J] . Bele M., Besenhard JO., Ribitsch V., Colloids and Surfaces, A. Physicochemical and Engineering Aspects . 1998,第1期

机译：基质诱导的明胶改性印刷电路板表面上炭黑的凝结第1部分。明胶吸附到印刷电路板表面上
2. Flexible copper wires through galvanic replacement of zinc paste: a highly cost-effective technology for wiring flexible printed circuits [J] . Liu Jingping, Yang Cheng, Zou Peichao, Journal of Materials Chemistry, C. materials for optical and electronic devices . 2015,第32期

机译：通过电镀替代锌浆的柔性铜线：一种用于布线柔性印刷电路的极具成本效益的技术
3. Flexible printed circuit doubles wiring density [J] . Electronic Engineering Times . 2009,第1565期

机译：柔性印刷电路使布线密度加倍
4. Polyester film substrates have been widely used in making relatively simple membrane touch switches and other flexible / printed electronic devices for over 30 years, yet since the early 2000's there has been an ever increasing desire to use "additive" printed electronics to replace "subtractive" etched circuitry in more complex, high performance, high value products. The ability to use flexible substrates in Roll-to-Roll productionSubstrates: Po [C] . Scott Gordon Web Coating and Handling Conference . 2016

机译：聚酯薄膜基材已广泛用于制造相对简单的膜触摸开关和其他柔性/印刷电子设备超过30年，然而自2000年初以来一直存在渴望使用“添加剂”印刷电子产品来取代“减数”蚀刻电路更复杂，高性能，高价值产品。在卷到卷材制造商中使用柔性基板的能力：PO
5. Inkjet Printed Microelectrodes on Flexible Substrates and Its Applications [D] . Kim, Yoontae. 2018

机译：柔性基板上的喷墨印刷微电极及其应用
6. Stone Paper as a New Substrate to Fabricate Flexible Screen-Printed Electrodes for the Electrochemical Detection of Dopamine [O] . Codruta Varodi, Florina Pogacean, Marin Gheorghe, 2020

机译：石纸作为制造用于电化学检测多巴胺的柔性丝网印刷电极的新基质
7. Special Articles: MCM Using Multi Layer Printed Wiring Boards, Organic Thin Film Multi Layer Printed Wiring Boards. RISC Module Using Silicon Substrate. MCM Performance Comparison. [O] . Takashi OKADA, Toshio SUDO 1993

机译：特殊文章：MCM采用多层印刷线路板，有机薄膜多层印刷线板。使用硅衬底的RISC模块。 MCM性能比较。

Flexible Substrate for Printed Wiring

摘要

著录项

引文网络

相似文献

相关主题

期刊订阅