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Reliability of CSP assemblies with underfill subjected to 4,000 extreme temperature cycles

机译：具有4,000个极端温度循环的底部填充的Csp组件的可靠性

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作者
Ghafarian, R.;
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年度 2002
页码 1-1
总页数 1
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
CHIPS; CYCLES; RELIABILITY; SOLDERS; reliability; chip scale package CSP area array package microvia thermal cycle solder joint;

机译：芯片;循环;可靠性;焊料;可靠性;芯片级封装Csp面阵列封装microvia热循环焊点;

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专利

1. Reliability study of underfill/chip interface under accelerated temperature cycling (ATC) loading [J] . Y.L. Zhang, D.X.Q. Shi, W. Zhou Microelectronics & Reliability . 2006,第2a4期

机译：加速温度循环（ATC）负载下底部填充/芯片界面的可靠性研究
2. Durability of composite assemblies under extreme conditions:Thermomechanical damage prediction of a double-lap bonded composite assembly subject to impact and high temperature [J] . Rizk Georgio, Nahas Roula, Khalil Khaled, Composite Structures . 2019,第apra期

机译：复合材料组件在极端条件下的耐久性：双搭接复合材料组件在冲击和高温下的热机械损伤预测
3. Assessment of long term reliability of photovoltaic glass-glass modules vs. glass-back sheet modules subjected to temperature cycles by FE-analysis [J] . Kraemer P., Wiese S. Microelectronics & Reliability . 2015,第5期

机译：通过有限元分析评估温度循环下光伏玻璃-玻璃组件与玻璃背板组件的长期可靠性
4. RELIABILITY OF FLIP CHIP ASSEMBLIES SUBJECTED TO EXTREME LOW TEMPERATURES [C] . M. Kaysar Rahim, Jeffrey C. Suhling, Richard C. Jaeger, Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems . 2006

机译：倒装芯片组件的可靠性受到极低温度的
5. Temperature cycling reliability of reballed and reworked ball grid array packages in tin-lead and SAC assembly. [D] . Nie, Lei. 2010

机译：锡铅和SAC组件中经过重新焊锡和重新加工的球栅阵列封装的温度循环可靠性。
6. Effect of Wafer Level Underfill on the Microbump Reliability of Ultrathin-Chip Stacking Type 3D-IC Assembly during Thermal Cycling Tests [O] . Chang-Chun Lee 2017

机译：晶圆级底部填充对热循环测试过程中超薄芯片堆叠式3D-IC组件微凸点可靠性的影响
7. Effect of Wafer Level Underfill on the Microbump Reliability of Ultrathin-Chip Stacking Type 3D-IC Assembly during Thermal Cycling Tests [O] . Chang-Chun Lee 2017

机译：晶圆级底部填充对热循环试验中超薄芯片堆叠式3D-IC组件微型泵可靠性的影响
8. Effect of Underfill on CSP Assembly Reliability [R] . Ghaffarian, R. 2000

机译：底部填充对Csp装配可靠性的影响

Reliability of CSP assemblies with underfill subjected to 4,000 extreme temperature cycles

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