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Evaluation of several silicone, phenolic, and expoxy base heat-shield materials at various heat-transfer rates and dynamic pressures

机译：在各种传热速率和动态压力下评估几种有机硅，酚醛树脂和环氧基隔热材料

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摘要

Elastomeric and rigid silicone, epoxy, and phenol resin base ablating materials evaluated at various heat transfer rates and dynamic pressures

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Chapman, A. J.;
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年度 1966
页码 1-58
总页数 58
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
ABLATION; ABLATIVE MATERIALS; DYNAMIC PRESSURE; ELASTOMERS; EPOXY RESINS; HEAT SHIELDING; HEAT TRANSFER; PHENOLIC RESINS; PHENOLS; REFRACTORY MATERIALS; SILICONE RESINS; SILICONES; ABLATING MATERIAL; DYNAMIC PRESSURE; EPOXY RESIN; HEAT TRANSFER; PHENOL RESIN; SILICONE RESIN;

机译：烧蚀; aBLaTIVE maTERIaLs;动态压力;弹性体;环氧树脂;热屏蔽;传播热量;酚醛树脂;酚;耐火材料;有机硅树脂;有机硅;消除材料;动态压力;环氧树脂;传播热量;苯酚树脂;有机硅树脂;

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3. Effect of high-pressure hot water washing treatment on fruit quality, insects, and disease in apples and pears. Part IV: Use of silicone-based materials and mechanical methods to eliminate surface arthropod eggs. [J] . Neven L G, Hansen J D, Spotts R A, Postharvest Biology and Technology . 2006,第3期

机译：高压热水洗涤处理对苹果和梨果实品质，昆虫和疾病的影响。第四部分：使用有机硅材料和机械方法消除表面节肢动物卵。
4. Electrical conductivity and thermal decomposition of high temperature phenolic- and silicone-based materials [C] . R. T. Johnson, R. M. Biefeld Annual Meeting of the Conference on Electrical Insulation and Dielectric Phenomena . 1981

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6. OSC45: Comparative Evaluation of Physical Properties of Nanoparticle Incorporated Addition Silicone with Other Elastomeric Impression Materials [O] . S. Padmasree, R. Vaishnavi, R. Sridharan 2018

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7. Mechanics/heat-transfer relation for particulate materials. Measure of particle pressure generated in a bed of FCC catalyst that is undergoing particulate fluidization [O] . C.S. Campbell 1991

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8. Evaluation of Several Silicone, Phenolic, and Expoxy Base Heat-Shield Materials at Various Heat-Transfer Rates and Dynamic Pressures [R] . Chapman, A. J. 1966

机译：几种有机硅，酚醛和环氧基热屏蔽材料在各种传热速率和动态压力下的评价

Evaluation of several silicone, phenolic, and expoxy base heat-shield materials at various heat-transfer rates and dynamic pressures

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