Manufacturing feasibility of several lead-free solders for electronic assembly

摘要

This paper reports on a surface mount assembly evaluation with a series of existing lead-free solders. The wettability of the lead-free solders under investigation was measured by the meniscometer/wetting balance technique. This data provided an initial screening assessment of viable candidates for prototype development. Assembly process capability was based on visual, mechanical and metallurgical analyses of prototype circuit boards. The study demonstrated the feasibility of using several of the lead-free solders tested in a surface mount application and identified specific areas (e.g., paste formulation, board finishes, reflow parameters) for improving the manufacturing performance.