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Improved Design Life and Environmentally Aware Manufacturing of Electronics Assemblies by Lead-Free Soldering.

机译：通过无铅焊接改善了设计寿命和环境意识到电子组件的制造。

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James H. Vincent;
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年度 1999
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1. How does electronics industry face the lead-free manufacturing - the key indicators of lead-free manufacturing [J] . Shih-Yuan Chiang, Chiu-Chi Wei, Te-Hsuan Chiang, Journal of information and optimization sciences . 2010,第1期

机译：电子行业如何面对无铅制造业-无铅制造业的关键指标
2. Lead-Free Assembly Design for Manufacturability Considerations [J] . MATT KELLY, MARK HOFFMEYER Printed Circuit Design . 2013,第2期

机译：出于可制造性考虑的无铅装配设计
3. 01005s and Lead-Free Solder - Tiny 01005s are challenging for any electronics assembly process, but they're even more so if that process is lead-free [J] . John Sprovieri Assembly . 2006,第5期

机译：01005s和无铅焊料-微小的01005s对于任何电子组装过程都具有挑战性，但如果该过程是无铅的，它们甚至更具挑战性
4. IDEALS Improved Design Life and Environmentally Aware Manufacturing of Electronics Assemblies by Lead-Free Soldering [C] . Martin R Harrison, James H Vincent 12th European microelectronics amp; packaging conference (IMAPS EUROPE '99) . 1999

机译：IDEALS通过无铅焊接延长了电子组件的设计寿命并提高了环保意识
5. Lead-free solders in surface mount electronic assemblies: Designs for quality and reliability [D] . Dang, Tung C. 2011

机译：表面安装电子组件中的无铅焊料：质量和可靠性设计
6. Eco-Friendly Lead-Free Solder Paste Printing via Laser-Induced Forward Transfer for the Assembly of Ultra-Fine Pitch Electronic Components [O] . Marina Makrygianni, Filimon Zacharatos, Kostas Andritsos, 2021

机译：通过激光引导的超细俯仰电子元件组装的激光诱导的前进转印的环保无铅焊膏印刷
7. Some assembly required: design <-- --> manufacturing design <-- --> assembly manufacturing <-- --> assembly [O] . Yousef Edgard Thompson 2021

机译：需要一些装配：设计< - >制造设计< - - >装配制造< - - >组装
8. Manufacturing feasibility of several lead-free solders for electronic assembly [R] . Jackson, A M, Artakl, I, Vianco, P T 1994

机译：几种用于电子组装的无铅焊料的制造可行性

Improved Design Life and Environmentally Aware Manufacturing of Electronics Assemblies by Lead-Free Soldering.

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