Planar surface-micromachined pressure sensors by chemical-mechanical polishing

摘要

Planar, surface micromachined pressure sensors have been fabricated by an extension of the chemical-mechanical polishing (CMP) process. CMP eliminates many of the fabrication problems associated with the photolithography, dry etch, and metallization of non-planar devices. Furthermore, CMP adds additional design flexibility. The sensors are based upon deformable, silicon nitride diaphragms with polysilicon piezoresistors. Absolute pressure is detected by virtue of reference pressure cavities underneath the diaphragms.