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LEAD FRAME BONDING:An Interconnections Development Area for the First-Generation Hybrid Microcircuit Technology Development Program

机译：LEaD FRamE BONDING：第一代混合微电路技术开发计划的互连开发区

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For abstract, see NSA 26 05, number 11469.

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作者
Donald R. Johnson;
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年度 1971
页码 1-35
总页数 35
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
Circuits;

机译：电路;

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LEAD FRAME BONDING:An Interconnections Development Area for the First-Generation Hybrid Microcircuit Technology Development Program

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