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Development of a CMOS (Complementary Metal Oxide Semiconductors) Process Using High Energy Ion Implantation

机译:利用高能离子注入技术开发CmOs(互补金属氧化物半导体)工艺

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The main interest of this thesis is the use of complementary metal oxide semiconductors (CMOS) in electronic technology. Problems in developing a CMOS process are mostly related to the isolation well of p-n junctions. It is shown that by using high energy ion implantation, it is possible to reduce lateral dimensions to obtain a rather high packing density. High energy ion implantation is also presented as a means of simplifying CMOS processing, since extended processing steps at elevated temperatures are superfluous. Process development is also simplified. (Auth.). Includes Dutch summary; 98 references, 70 figures, 7 tables. (ERA citation 12:029737)

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