Silicon micromachining based on porous silicon formation.

摘要

The mechanical strength of silicon, in combination with the sophisticated silicon wafer processing techniques developed to produce silicon integrated circuits, makes it an ideal candidate for the development of a microelectromechanical device technology. We describe a new electrochemical processing technique based on porous silicon that can produce surface and buried insulators, conductors, and sacrificial layers required for sensor, micromotor, and membrane fabrication. 4 refs., 2 figs.