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Ge-Au eutectic bonding of Ge (left brace)100(right brace) single crystals.

机译:Ge-au共晶键合Ge(左支撑)100(右支撑)单晶。

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We present preliminary results on eutectic bonding between two (100) Ge single crystal surfaces using thin films of Au ranging from 900(Angstrom)/surface and Pd(10% the thickness of Au). Following bonding, plan view optical microscopy (OM) of the cleaved interface of samples with Au thicknesses (le) 500(Angstrom)/surface show a eutectic morphology more conducive to phonon transmission through the bond interface. High resolution transmission electron microscopy (HRTEM) cross sectional interface studies of a 300(Angstrom)/surface Au sample show epitaxial growth of Ge. In sections of the bond, lattice continuity of the Ge is apparent through the interface. TEM studies also reveal heteroepitaxial growth of Au with a Au-Ge lattice mismatch of less than 2%. Eutectic bonds with 200(Angstrom)/surface Au have been attained with characterization pending. An optical polishing technique for Ge has been optimized to insure intimate contact between the Ge surfaces prior to bonding. Interferometry analysis of the optically polished Ge surface shows that surface height fluctuations lie within (plus minus)150(Angstrom) across an interval of 1mm. Characterization of phonon transmission through the interface is discussed with respect to low temperature detection of ballistic phonons.

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