Waste Minimization in Circuit Board Manufacturing by PARMOD(TM) technology

摘要

In Phase I of this SBIR Contract the feasibility of producing well- consolidated, well-bonded silver conductors by a simple print-and-heat process was demonstrated. The objectives of Phase II have been to extend this PARMOD(TM) technology to copper conductors and to electrostatic printing. Successful copper ink formulations and oven treating conditions have been found which very nearly equal the performance of silver inks. A major increase in our understanding of the chemistry of the process has provided an entirely new class of PARMOD(TM) formulations with superior performance and potential for future improvement. A much improved approach to electrostatic toner materials based on liquid toner technology has been demonstrated. The ability of this technology to produce high resolution circuits quickly over a large area should provide opportunities in high density interconnect applications. These achievements have been the basis of further development and evaluation in selected markets. A Dual Use application to prototyping printed wiring boards and metallizing vias is under active development with the U.S. Army. PARMOD(TM) liquid toners for metallizing microvias and high density interconnects in advanced technology PWBs and multichip modules have been proposed for demonstration in an industry-wide consortium. Low-cost, high-volume production of flexible printed circuits is being developed for specific applications.