Decomposed Analysis of the Reliability of Area-Array Electronic Packages Including Assembly Process Effects

摘要

The research presented in this thesis focuses on the use of a decomposed analysis technique to assess the reliability impact on area-array packages due to assembly process effects. The developed models enable one to determine the equilibrium configuration of electronic packages with warped and non-warped solder joints with significant computational efficiency at a reasonable accuracy. The code described herein uses a nonlinear optimization procedure that ensures the approximate satisfaction of the energy balance equation. The developed procedure is demonstrated on two- and three-dimensional hypothetical and 'real-world' electronic packages with warped and non-warped solder joints. It is shown that with the use of the decomposed solution methodology, for a 225 I/O PBGA package with non-warped solder joints, a speedup of nearly seven times is achieved at an accuracy loss in displacements of approximately 5.46%. Since the analysis procedure is independent of the number of solder interconnects, significantly larger time savings are expected for larger packages.