Micromachined Microjet Array Impingement Cooling Device for High Power Electronics

摘要

This grant are to simulate and fabricate an optimized micromachined microjet array (MJA) impingement cooling device for high power electronics. A chip-scale microjet impingement cooling device will also be implemented with heat source fabricated on its target plate. There are three main tasks for this project. Task 1 is to develop micromachining processes for the fabrication of the MJA impingement cooling device. Task 2 is to obtain an optimized design for the MJA impingement cooling device based on simulation. Task 3 is to apply the optimized device in an application.