Integrate Thermal Modules for Cooling Silicon and Silicon Carbide Power Modules

摘要

A primary limiting factor of solid state converters is thermal management. If chips run too hot, the life of the converter can be drastically shortened. For armored applications weight, size, and cooling temperatures are critical. The objective here in is to use high-conductivity graphite in integrated thermals modules (ITMs) to effectively cool silicon (Si) IGBTs, Si diodes and Silicon Carbide (SiC) diodes. For a basis of comparing the performance of the ITMs, we are using the Semikron 100 kW SKAI inverter to quantify and generate loads. In Semikron's standard SKAI inverter, there are 12 IGBT's and 6 Silicon diodes. Advanced thermal management techniques are being developed for Semikron's standard SKAI as well as one that uses Silicon Carbide (SiC) diodes. For the later case, as part of this program, Semikron assembled the converter using the SiC diodes. Both the standard and SiC diode converters are being evaluated with different ITMs to enable higher temperature fluids for cooling to enable smaller fluid-to-air heat exchangers for under-armor applications in military vehicles. In addition, for simpler ITM configurations, the ITMs may find cost effective commercial applications.