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ENHANCED MICRO-MODULE INTERCONNECTIONS AN HERMETIC PACKAGING SYSTEM FOR THE INTEGRATION OF MICRO CIRCUITS 1st QUARTERLY REPORT

机译：增强微型模块互连用于集成微电路的密封包装系统第一季度报告

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Prograin enhanced micro module interconnections a hermetic packaging system for the integration of micro circuits has been subdivided into the following phases:nPreproduction effortnToolingnPilot line and production run.

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G. F. Lang; D. J. Garibotti;
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年度 1963
页码 1-83
总页数 83
原文格式 PDF
正文语种 eng
中图分类工业技术;
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专利

1. Integrated Systems-in-Package: Heterogeneous Integration of Millimeter-Wave Active Circuits and Passives in Fan-Out Wafer-Level Packaging Technologies [J] . Amelie Hagelauer, Maciej Wojnowski, Klaus Pressel, IEEE microwave magazine . 2018,第1期

机译：集成式系统级封装：扇出晶圆级封装技术中毫米波有源电路和无源器件的异构集成
2. Micro-Coil Spring Interconnection for Ceramic Grid Array Packaged Integrated Circuits [J] . NASA Tech Briefs . 2014,第12期

机译：陶瓷网格阵列封装集成电路的微线圈弹簧互连
3. Wafer-level hermetic packaged microaccelerometer with fully differential BiCMOS interface circuit [J] . Ko H, Park S, Choi B, Sensors and Actuators, A. Physical . 2007,第1期

机译：具有全差分BiCMOS接口电路的晶圆级密封封装微加速度计
4. VIA-FREE INTERCONNECTION IN QUASI-HERMETIC WAFER-LEVEL PACKAGING FOR RF-MEMS APPLICATIONS AND 3D INTEGRATION [C] . Alain Phommahaxay, Gaelle Lissorgues, Lionel Rousseau, International Solid-State Sensors, Actuators and Microsystems Conference . 2007

机译：用于RF-MEMS应用和3D集成的准密封晶片级包装中的可通过自由互连
5. Hermetic packaging and bonding technologies for implantable microsystems. [D] . Harpster, Timothy J. 2005

机译：植入式微系统的密封包装和粘合技术。
6. Hermetically Packaged Microsensor for Quality Factor-Enhanced Photoacoustic Biosensing [O] . Imran Latif, Masaya Toda, Takahito Ono 2020

机译：密封封装的微传感器用于提高质量因子的光声生物传感
7. Packaging of Microfluidic systems: A microfluidic Motherboard Integrating Fluidic and Optical Interconnections [O] . Perozziello Gerardo 2008

机译：微流体系统的封装：集成流体和光学互连的微流体主板
8. Enhanced Micro-Module Interconnections. An Hermetic Packaging System for the Integration of Micro Circuits [R] . Collins, R., Garibotti, D. J. 1964

机译：增强的微模块互连。用于微电路集成的密封包装系统

ENHANCED MICRO-MODULE INTERCONNECTIONS AN HERMETIC PACKAGING SYSTEM FOR THE INTEGRATION OF MICRO CIRCUITS 1st QUARTERLY REPORT

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