Enhanced Micro-Module Interconnections. An Hermetic Packaging System for the Integration of Micro Circuits

摘要

The adaptation of previously developed techniques into manufacturing processes has been successfully completed. These processes were subjected to operation checkouts to establish compatibility with the objective of the programs which is to establish production capability of manufacturing the Enhanced Micro Modules on a pilot line basis at the rate of 100 units per eight hour shift. The proposed Microwafer Design Guide, the preliminary cost analysis of the completely assembled Enhanced Micro Modules and a manual describing the Inspection and Quality Control Procedures to be used in the production of the Engineering Model Design Modules were prepared. All equipment necessary in the fabrication of microwafers have been installed and subjected to operational checkouts. The machines which will be used in the assembly of the Enhanced Micro Modules have been installed and developed into operational units. The design and construction of a semi-automatic wafer inspection machine was completed. (Author)