Research on Radiation-Resistant High-Temperature Thermionic Circuitry

摘要

This report discusses the progress and problems encountered in designing and fabricating radiation tolerant, high temperature, Thermionic Integrated MicroModule (TIMM) circuit elements and functional circuitry. The objectives of the program were to perform applied research toward the evaluation and processing of materials exhibiting stable and superior physiochemical characteristics over the temperature range up to 600C, and to incorporate such materials into devices, modules and integrated circuits for reliable operation in severe mechanical, thermal and radiation environments. Functional circuits, fabricated to demonstrate feasibility of the TIMM concept, have been designed to operate at 580C. This program has shown that many opportunities still exist for further size and weight reductions by the combination of individual circuit elements into multi-structure, functional elements.