MEANS OF LOWERING THE CURING TEMPERATURE OF HEATPROOF ORGANO-SILICON ADHESIVES

摘要

A heat resistant adhesive is used for the bonding of parts which are intended for operation at elevated temperatures [1-3]. For instance the VK-2 adhesive assures bonded joints a strength for 1000 hours at a temperature ranging up to 350°C, for 250 hours at 400°C and briefly at 1000°C.