Research in Microminiaturization Using Electron-Activated Machining Techniques

摘要

The underlying theme was the development of a thin-film deposition and high-resolution micromachining technology that would ultimately permit the fabrication of data-processing systems having large numbers of suitably intercoupled active devices entirely under contaminant-free ultra-high-vacuum conditions. Only refractory metals and dielectrics would be utilized in the final structures to achieve the required degree of stability, uniformity, and operational life. Progress on the basic ultra-high-vacuum technology and ancillary instrumentation is described, including: vacuum stations designed for bakeout at 900C and capable of rapidly attaining pressures of the order of 10 to the minus 12th power torr; precision electron optical columns having resolutions of several hundred angstrom units after 900C bakeout; and compatible quadrupole mass spectrometers, continuous-dynode electron multipliers, thin film deposition sources, manipulators, and other accessories. The development of suitable electron-sensitive resists, the use of which forms the basis for achieving high resolution in thin-film micromachining, is covered and the various techniques for etching unprotected film areas are described. Applications of this thin-film technology to the formation of micron-size electron devices, now supported primarily under separate contracts, are covered briefly. This work includes the development of refractory micron-size electron tubes operating on field-emission principles and novel high-speed, high-capacity storage tubes. (Author)