Ultrasonic Beam Lead Bonding Equipment

摘要

Initial effort established the feasibility and practicability of an ultrasonic torsional welding system for simultaneously bonding the beam leads of a hybrid integrated circuit device to a suitable substrate. The design, fabrication, and evaluation of a laboratory welder for this application delineated requirements for an experimental ultrasonic beam lead bonder for field evaluation. The experimental unit consisted of a 60-kHz ultrasonic torsional welding system installed in a modified commercial micropositioner which provided x-y positioning of the beam leaded chip and incorporated an optical system with indexing for visual alignment of the chip. The welder accepts electrical power input up to about 50 watts and weld time up to 1.2 seconds; experimental data indicate this capability to be adequate for bonding commercially available beam lead devices. The process represents a practical alternative to current beam lead bonding techniques. (Author)