首页> 美国政府科技报告 >The Physics of Interface Interactions Related to Reliability of Future Electronic Devices.
【24h】

The Physics of Interface Interactions Related to Reliability of Future Electronic Devices.

机译:与未来电子器件可靠性相关的界面相互作用物理。

获取原文

摘要

Contents:The reliability of semiconductor-insulator interfaces-(Impact ionization model for dielectric instability breakdown;Phosphorus precipitation on Si/SiO2interfaces);Band structure and switching in insulators--(Optical properties of allotropic forms of SiO2;Structural transformations as observed by TEM during electrical switching in amorphous Ge-Te);Instabilities associated with metal-glass Interactions--(Analysis of thin film structures with nuclear backscattering and X-ray diffraction;Reactions of thin metal films with Si or SiO2substrates).

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号