Pyroelectric/Integrated Circuit Infrared Imaging Array Development.

摘要

The processing techniques and steps required to form two-dimensional arrays of thin film triglycine sulfate detectors on field-effect integrated circuit substrates are reviewed. The approach to providing the required high degree of thermal isolation between the polycrystalline detectors and the silicon portion of the circuit is to etch away the silicon underlying the detectors. A second pyroelectric imaging array consisting of a thin permanently poled single crystal section of TGS positioned above the integrated circuit substrate is also described. In this arrangement the resulting air gap provides the thermal isolation and contacts to the array detectors are made by means of vacuum deposited microfinger springs.