Deleterious Effect of MIL-F-14256,Type RA Fluxes on Printed Wiring Boards.

摘要

This study identified the corrosive effects of Type RA fluxes and flux residues on printed wiring boards subjected to electrical stress in a humid environment at elevated temperature. The effect of varying delay times between soldering and cleaning of flux residues was also studied and the protective value of solder resist and conformal coating was evaluated. (Author)