Manufacturing Technology Program for High Burnout Silicon Schottky-Barrier Mixer Diodes for Navy Air-to-Air Avionics

摘要

This report describes the establishment of low cost semiconductor processes to manufacture low-barrier-height high-burnout X-band silicon Schottky barrier diodes in production quantities. These devices are thermal-compression-bonded in a rugged low-cost pill (ODS-119) package. They exhibit an overall low noise figure of 7.0 dB (single side band) at 0.5 mW of local oscillator power level and RF burnout of 12 watts (tau = 1 microsec and 1000 Hz rep. rate). Reliability and ruggedness of the design has been demonstrated by tests taken from MIL.S 19500 F. (Author)