Automated Multi-Modal Serial Sectioning System for Characterization of Grain-Scale Microstructures in Engineering Materials (Preprint).

摘要

This paper describes the development of a new serial sectioning system that has been designed to collect microstructural, crystallographic, and chemical information from volumes in excess of 1 cu mm. The system integrates a robotic multi-platen mechanical polishing system with a modern SEM that enables the acquisition of multi-modal data--scanning electron images, EBSD and hyperspectral EDS map--at each section. Selected details of the system construction as well as an initial demonstration of the system capabilities are presented.