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An Automated Multi-Modal Serial Sectioning System for Characterization of Grain-Scale Microstructures in Engineering Materials

机译:一种自动多模态串行切片系统,用于设计工程材料中晶粒尺度微观结构的特征

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This paper describes the development of a new serial sectioning system that has been designed to collect microstructural, crystallographic, and chemical information from volumes in excess of 1 mm~3. The system integrates a robotic multi-platen mechanical polishing system with a modern SEM that enables the acquisition of multi-modal data-scanning electron images, EBSD and hyperspectral EDS map-at each section. Selected details of the system construction as well as an initial demonstration of the system capabilities are presented.
机译:本文介绍了一种新的串行切片系统的开发,该系统被设计为从超过1mm〜3的体积收集微观结构,晶体和化学信息。该系统集成了一个机器人多压板机械抛光系统,具有现代化的SEM,使得能够在每个部分采集多模态数据扫描电子图像,EBSD和高光谱EDS映射。提供了系统构造的详细信息以及系统能力的初始演示。

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