Solid-State Threshold Accelerometer Chip

摘要

Micromechanical cantilever beam structures having a maximum length of 0.16 in. were designed, fabricated, and tested in six configurations for use as threshold acceleration sensors for projectile fuzes. Their small size and ability to be produced using monolithic fabrication techniques commonly used to make integrated circuits provides the possibility of incorporating multiswitch arrays into a single die surface area one hundredth of a square inch. Design, fabrication, and test details are provided for two triple-beam arrays of cantilever structures made from 3-micrometer-thick silicon dioxide. (Author)